Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418971 | Package-on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-08-16 |
| 9412689 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2016-08-09 |
| 9412723 | Package on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9397062 | Package on package bonding structure and method for forming the same | Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-19 |
| 9379032 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Yu-Feng Chen, Chen-Shien Chen | 2016-06-28 |
| 9373610 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Chung-Shi Liu | 2016-06-21 |
| 9343386 | Alignment in the packaging of integrated circuits | Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-05-17 |
| 9263412 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Wei-Yu Chen, Hsiu-Jen Lin | 2016-02-16 |