Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524956 | Integrated fan-out structure and method | Hao-Jan Pei, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-12-20 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Meng-Tse Chen, Hui-Min Huang +2 more | 2016-11-29 |
| 9484227 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2016-11-01 |
| 9427818 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-30 |
| 9425157 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2016-08-23 |
| 9412717 | Apparatus and methods for molded underfills in flip chip packaging | Meng-Tse Chen, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9412723 | Package on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9373603 | Reflow process and tool | Ai-Tee Ang, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-06-21 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-05-31 |
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2016-05-03 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-03-08 |
| 9263412 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Wei-Yu Chen, Kuei-Wei Huang | 2016-02-16 |
| 9230935 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-01-05 |