Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484227 | Dicing in wafer level package | An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2016-11-01 |
CC
Chia-Shen Cheng
Overall (2016): #443,964 of 481,213Top 95%
1
Patents 2016