Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524942 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, Chi-Hsi Wu | 2016-12-20 |
| 9502364 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2016-11-22 |
| 9484227 | Dicing in wafer level package | Chia-Shen Cheng, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2016-11-01 |
| 9478443 | Semiconductor package and method of forming the same | Hsien-Wei Chen | 2016-10-25 |
| 9478521 | Package-on-package Structure | Hsien-Wei Chen, Ying-Ju Chen | 2016-10-25 |
| 9293442 | Semiconductor package and method | Hsien-Wei Chen | 2016-03-22 |