Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524942 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su | 2016-12-20 |
| 9502343 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2016-11-22 |
| 9368628 | FinFET with high mobility and strain channel | Hou-Ju Li, Kao-Ting Lai, Kuo-Chiang Ting | 2016-06-14 |
| 9281254 | Methods of forming integrated circuit package | Chen-Hua Yu, Wen-Chih Chiou, Hsiang-Fan Lee, Shih-Peng Tai, Tang-Jung Chiu | 2016-03-08 |