Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401395 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Chen-Jong Wang | 2016-07-26 |
| 9281254 | Methods of forming integrated circuit package | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Shih-Peng Tai, Tang-Jung Chiu | 2016-03-08 |
| 9269762 | Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers | Kuo-Chyuan Tzeng, Luan C. Tran, Chen-Jong Wang, Kuo-Chi Tu | 2016-02-23 |
| 9263415 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Chen-Jong Wang | 2016-02-16 |
| 9257409 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Chen-Jong Wang | 2016-02-09 |