Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508722 | Semiconductor arrangment with capacitor | Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Xiaomeng Chen | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-11-22 |
| 9466663 | Semiconductor arrangement having capacitor separated from active region | Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Xiaomeng Chen | 2016-10-11 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-09-13 |
| 9425247 | Metal-insulator-metal capacitor with current leakage protection | Huey-Chi Chu, Kuo-Ji Chen, Ming-Hsiang Song, Wen-Chuan Chiang | 2016-08-23 |
| 9425228 | Image sensor with reduced optical path | Shyh-Fann Ting, Ching-Chun Wang, Wei Chuang Wu, Yu-Jen Wang, Chun-Ming Su +1 more | 2016-08-23 |
| 9401395 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-07-26 |
| 9269762 | Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers | Kuo-Chyuan Tzeng, Luan C. Tran, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-02-23 |
| 9263415 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-02-16 |
| 9257409 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-02-09 |