Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502396 | Air trench in packages incorporating hybrid bonding | Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-11-22 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-09-13 |
| 9422155 | Capacitive sensors and methods for forming the same | Jung-Kuo Tu, Chen-Chih Fan | 2016-08-23 |
| 9346666 | Composite wafer semiconductor | — | 2016-05-24 |
| 9322862 | Capacitive sensing array device with high sensitivity and electronic apparatus using the same | Shih-Chieh Hsu | 2016-04-26 |
| 9318528 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2016-04-19 |
| 9298317 | Stray-light-coupled biometrics sensing module and electronic apparatus using the same | — | 2016-03-29 |
| 9254999 | Mechanisms for forming micro-electro mechanical device | Yang-Che Chen, Chen-Chih Fan | 2016-02-09 |