Issued Patents 2016
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530811 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu | 2016-12-27 |
| 9525003 | Structure and method for 3D image sensor | Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2016-12-20 |
| 9520433 | Method of fabricating deep trench isolation structure in image sensor and device thereof | Hsin-Hung Chen, Jen-Cheng Liu, Alexander Kalnitsky, Wen-De Wang | 2016-12-13 |
| 9473753 | Apparatus and method for reducing optical cross-talk in image sensors | Chin-Min Lin, Ching-Chun Wang, Tzu-Hsuan Hsu, Chun-Ming Su | 2016-10-18 |
| 9455288 | Image sensor structure to reduce cross-talk and improve quantum efficiency | Shuang-Ji Tsai, Jen-Cheng Liu, Feng-Chi Hung, Jeng-Shyan Lin, Wen-De Wang | 2016-09-27 |
| 9455158 | 3DIC interconnect devices and methods of forming same | Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Tzu-Hsuan Hsu, Feng-Chi Hung | 2016-09-27 |
| 9449914 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Ying-Ling Tsai | 2016-09-20 |
| 9443836 | Forming pixel units of image sensors through bonding two chips | Szu-Ying Chen, Meng-Hsun Wan, Tzu-Jui Wang, Jen-Cheng Liu | 2016-09-13 |
| 9437578 | Stacked IC control through the use of homogenous region | Wen-I Hsu, Cheng-Ying Ho, Jeng-Shyan Lin, Feng-Chi Hung | 2016-09-06 |
| 9425150 | Multi-via interconnect structure and method of manufacture | Yu-Fei Huang, Ming Li, Edward Wan, Jacob Chen, Cheng-Eng D. Chen | 2016-08-23 |
| 9412725 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu +1 more | 2016-08-09 |
| 9412719 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2016-08-09 |
| 9406711 | Apparatus and method for backside illuminated image sensors | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Ping-Yin Liu, Lan-Lin Chao | 2016-08-02 |
| 9406715 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung | 2016-08-02 |
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Jen-Cheng Liu, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2016-08-02 |
| 9401380 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2016-07-26 |
| 9391109 | Uniform-size bonding patterns | Szu-Ying Chen | 2016-07-12 |
| 9391114 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Feng-Chi Hung, Min-Feng Kao, Jeng-Shyan Lin, Chun-Ming Su +1 more | 2016-07-12 |
| 9391101 | Image sensor pickup region layout | Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu | 2016-07-12 |
| 9373657 | System and method for fabricating a 3D image sensor structure | Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang | 2016-06-21 |
| 9368545 | Elevated photodiodes with crosstalk isolation | Yi-Shin Chu, Cheng-Tao Lin, Meng-Hsun Wan, Szu-Ying Chen, Jen-Cheng Liu | 2016-06-14 |
| 9362329 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2016-06-07 |
| 9356066 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2016-05-31 |
| 9355888 | Implant isolated devices and method for forming the same | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2016-05-31 |
| 9355964 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2016-05-31 |