Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, U-Ting Chen | 2016-08-02 |
| 9360755 | Thickening phase for spin coating process | Chun-Wei Chang, Chih-Chien Wang, Wang-Pen Mo, Hung-Chang Hsieh | 2016-06-07 |