Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437572 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2016-09-06 |
| 9412719 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2016-08-09 |
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Chia-Chieh Lin | 2016-08-02 |
| 9355964 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2016-05-31 |
| 9293392 | 3DIC interconnect apparatus and method | Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Lin Chia-Chieh, Shu-Ting Tsai +4 more | 2016-03-22 |