Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412719 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou | 2016-08-09 |
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, Chia-Chieh Lin | 2016-08-02 |