Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9525003 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2016-12-20 |
| 9455158 | 3DIC interconnect devices and methods of forming same | Szu-Ying Chen, Jeng-Shyan Lin, Tzu-Hsuan Hsu, Feng-Chi Hung, Dun-Nian Yaung | 2016-09-27 |
| 9412719 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2016-08-09 |
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2016-08-02 |
| 9356066 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2016-05-31 |
| 9293392 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Lin Chia-Chieh +4 more | 2016-03-22 |
| 9287312 | Imaging sensor structure and method | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2016-03-15 |