Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293392 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Lin Chia-Chieh, Shu-Ting Tsai +4 more | 2016-03-22 |
| 9252296 | Semiconductor device with compressive layers | Chih-Yu Lai, Chih-Hui Huang, Cheng-Ta Wu, Yeur-Luen Tu, Ching-Chun Wang +2 more | 2016-02-02 |