Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508769 | Semiconductor structure and method of manufacturing the same | Sheng-Chan Li, Cheng-Yuan Tsai, Yeur-Luen Tu | 2016-11-29 |
| 9490158 | Bond chuck, methods of bonding, and tool including bond chuck | Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2016-11-08 |
| 9437572 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Yeur-Luen Tu | 2016-09-06 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Yan-Chih Lu +2 more | 2016-05-03 |
| 9252296 | Semiconductor device with compressive layers | Chun-Han Tsao, Chih-Yu Lai, Cheng-Ta Wu, Yeur-Luen Tu, Ching-Chun Wang +2 more | 2016-02-02 |