Issued Patents 2016
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9525130 | Phase change memory and method of fabricating same | Tsun-Kai Tsao, Ming-Huei Shen, Shih-Chang Liu, Chia-Shiung Tsai | 2016-12-20 |
| 9508769 | Semiconductor structure and method of manufacturing the same | Sheng-Chan Li, Chih-Hui Huang, Cheng-Yuan Tsai | 2016-11-29 |
| 9508659 | Method and apparatus to protect a wafer edge | Chen-Fa Lu, Shu-Ju Tsai, Cheng-Ta Wu, Chia-Shiung Tsai, Xiaomeng Chen | 2016-11-29 |
| 9490158 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai +2 more | 2016-11-08 |
| 9437572 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang | 2016-09-06 |
| 9425343 | Mechanisms for forming image sensor device | Chih-Yu Lai, Cheng-Ta Wu, Chia-Shiung Tsai, Jhy-Jyi Sze, Shyh-Fann Ting +1 more | 2016-08-23 |
| 9418999 | MIM capacitors with improved reliability | Chih-Ta Wu, Jason Lee, Chung Chien Wang, Hsing-Lien Lin, Yu-Jen Wang +4 more | 2016-08-16 |
| 9412781 | Photodiode gate dielectric protection layer | Cheng-Hsien Chou, Wen-I Hsu, Tsun-Kai Tsao, Chih-Yu Lai, Jiech-Fun Lu | 2016-08-09 |
| 9355964 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2016-05-31 |
| 9349768 | CMOS image sensor with epitaxial passivation layer | Yu-Hung Cheng, Tung-Hsiung Tseng, Cheng-Ta Wu, Chia-Shiung Tsai, Ru-Liang Lee +4 more | 2016-05-24 |
| 9337225 | Semiconductor device and manufacturing method thereof | Hung-Wen Hsu, Jung-I Lin, Ching-Chung Su, Jiech-Fun Lu, Chia-Shiung Tsai | 2016-05-10 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Xin-Hua Huang, Chih-Hui Huang, Lan-Lin Chao, Yan-Chih Lu +2 more | 2016-05-03 |
| 9324668 | Bonding structures and methods of forming the same | Luan C. Tran, Ching-Chun Wang | 2016-04-26 |
| 9293392 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Lin Chia-Chieh +4 more | 2016-03-22 |
| 9281331 | High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor | Sheng-Chau Chen, Chih-Yu Lai, Kuo-Ming Wu, Kuo-Hwa Tzeng, Cheng-Hsien Chou +2 more | 2016-03-08 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao +2 more | 2016-02-09 |
| 9252296 | Semiconductor device with compressive layers | Chun-Han Tsao, Chih-Yu Lai, Chih-Hui Huang, Cheng-Ta Wu, Ching-Chun Wang +2 more | 2016-02-02 |
| 9245974 | Performance boost by silicon epitaxy | Yu-Hung Cheng, Cheng-Ta Wu, Chia-Shiung Tsai, Ru-Liang Lee, Tung-I Lin +1 more | 2016-01-26 |