Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-11-22 |
| 9425155 | Wafer bonding process and structure | Ping-Yin Liu, Cheng-Tai Hsiao, Xin-Hua Huang, Lan-Lin Chao | 2016-08-23 |
| 9257399 | 3D integrated circuit and methods of forming the same | Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2016-02-09 |