Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425155 | Wafer bonding process and structure | Ping-Yin Liu, Hsun-Chung Kuang, Xin-Hua Huang, Lan-Lin Chao | 2016-08-23 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2016-02-09 |