Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9527188 | Grinding wheel for wafer edge trimming | Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-12-27 |
| 9508586 | Debonding schemes | Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-11-22 |
| D770617 | Endoscope system workstation | Ye Hong, Junwei Xu, Han Xu, Tengfei Yang | 2016-11-01 |
| 9478471 | Apparatus and method for verification of bonding alignment | Ping-Yin Liu, Lan-Lin Chao | 2016-10-25 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2016-09-20 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-09-13 |
| 9425155 | Wafer bonding process and structure | Ping-Yin Liu, Hsun-Chung Kuang, Cheng-Tai Hsiao, Lan-Lin Chao | 2016-08-23 |
| 9385010 | Multiple swivel arm design in hybrid bonder | Ping-Yin Liu, Lan-Lin Chao | 2016-07-05 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Chih-Hui Huang, Lan-Lin Chao, Yeur-Luen Tu, Yan-Chih Lu +2 more | 2016-05-03 |
| 9293303 | Low contamination chamber for surface activation | Ping-Yin Liu, Lee-Chuan Tseng, Lan-Lin Chao | 2016-03-22 |