Issued Patents 2016
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530685 | Isolation trench through backside of substrate | Ming Chyi Liu, Sheng-De Liu, Chi-Ming Chen, Che-Ming Chang, Chung-Yen Chou | 2016-12-27 |
| 9527188 | Grinding wheel for wafer edge trimming | Xin-Hua Huang, Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao | 2016-12-27 |
| 9525130 | Phase change memory and method of fabricating same | Tsun-Kai Tsao, Ming-Huei Shen, Shih-Chang Liu, Yeur-Luen Tu | 2016-12-20 |
| 9508722 | Semiconductor arrangment with capacitor | Chern-Yow Hsu, Shih-Chang Liu, Xiaomeng Chen, Chen-Jong Wang | 2016-11-29 |
| 9508659 | Method and apparatus to protect a wafer edge | Chen-Fa Lu, Yeur-Luen Tu, Shu-Ju Tsai, Cheng-Ta Wu, Xiaomeng Chen | 2016-11-29 |
| 9508586 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-11-22 |
| 9502514 | Memory devices and method of forming same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2016-11-22 |
| 9502493 | Multi-step method of forming a metal film | Kai-Wen Cheng, Cheng-Yuan Tsai | 2016-11-22 |
| 9490158 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai +2 more | 2016-11-08 |
| 9484537 | Organic photo diode with dual electron blocking layers | Chin-Wei Liang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2016-11-01 |
| 9484351 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2016-11-01 |
| 9478632 | Method of manufacturing a semiconductor device | Po-Chun Liu, Chi-Ming Chen, Chen-Hao Chiang, Chung-Yi Yu, Xiaomeng Chen | 2016-10-25 |
| 9472504 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ming-Tung Wu, Ping-Yin Liu, Lan-Lin Chao | 2016-10-18 |
| 9466663 | Semiconductor arrangement having capacitor separated from active region | Chern-Yow Hsu, Shih-Chang Liu, Xiaomeng Chen, Chen-Jong Wang | 2016-10-11 |
| 9450057 | Split gate cells for embedded flash memory | Chang-Ming Wu, Shih-Chang Liu, Ru-Liang Lee | 2016-09-20 |
| 9450183 | Memory structure having top electrode with protrusion | Jian-Shiou Huang, Yao-Wen Chang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2016-09-20 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh +2 more | 2016-09-20 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-09-13 |
| 9431609 | Oxide film scheme for RRAM structure | Trinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Ru-Liang Lee | 2016-08-30 |
| 9425240 | Image sensors with organic photodiodes and methods for forming the same | Chin-Wei Liang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2016-08-23 |
| 9425343 | Mechanisms for forming image sensor device | Chih-Yu Lai, Cheng-Ta Wu, Yeur-Luen Tu, Jhy-Jyi Sze, Shyh-Fann Ting +1 more | 2016-08-23 |
| 9425061 | Buffer cap layer to improve MIM structure performance | Yao-Wen Chang, Jian-Shiou Huang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2016-08-23 |
| 9419218 | Resistance variable memory structure and method of forming the same | Fu-Ting Sung, Ching-Pei Hsieh, Chern-Yow Hsu, Shih-Chang Liu | 2016-08-16 |
| 9418901 | Semiconductor device containing HEMT and MISFET and method of forming the same | Chung-Yen Chou, Sheng-De Liu, Fu-Chih Yang, Shih-Chang Liu | 2016-08-16 |