Issued Patents 2016
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9527188 | Grinding wheel for wafer edge trimming | Xin-Hua Huang, Ping-Yin Liu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2016-12-27 |
| 9508586 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Chia-Shiung Tsai | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-11-22 |
| 9478471 | Apparatus and method for verification of bonding alignment | Xin-Hua Huang, Ping-Yin Liu | 2016-10-25 |
| 9472504 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ming-Tung Wu, Ping-Yin Liu, Chia-Shiung Tsai | 2016-10-18 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh +2 more | 2016-09-20 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-09-13 |
| 9425155 | Wafer bonding process and structure | Ping-Yin Liu, Hsun-Chung Kuang, Cheng-Tai Hsiao, Xin-Hua Huang | 2016-08-23 |
| 9412725 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu +1 more | 2016-08-09 |
| 9406711 | Apparatus and method for backside illuminated image sensors | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Ping-Yin Liu | 2016-08-02 |
| 9385010 | Multiple swivel arm design in hybrid bonder | Xin-Hua Huang, Ping-Yin Liu | 2016-07-05 |
| 9377401 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2016-06-28 |
| 9355882 | Transfer module for bowed wafers | Ming-Tung Wu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2016-05-31 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin +2 more | 2016-05-10 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Xin-Hua Huang, Chih-Hui Huang, Yeur-Luen Tu, Yan-Chih Lu +2 more | 2016-05-03 |
| 9293303 | Low contamination chamber for surface activation | Ping-Yin Liu, Xin-Hua Huang, Lee-Chuan Tseng | 2016-03-22 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Yeur-Luen Tu +2 more | 2016-02-09 |
| 9242853 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Li-Cheng Chu, Hung-Hua Lin, Chih-Jen Chan | 2016-01-26 |