RC

Richard Chu

TSMC: 1 patents #1,374 of 2,623Top 55%
📍 Taipei, OH: #2 of 3 inventorsTop 70%
Overall (2016): #254,179 of 481,213Top 55%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9337168 Hermetic wafer level packaging Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more 2016-05-10