Issued Patents 2016
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9522822 | Sensor integration with an outgassing barrier and a stable electrical signal path | Chun-Wen Cheng | 2016-12-20 |
| 9511997 | MEMS device with a capping substrate | Chun-Wen Cheng | 2016-12-06 |
| 9505605 | Methods and apparatus for MEMS devices with increased sensitivity | Chun-Wen Cheng | 2016-11-29 |
| 9499396 | MEMS devices and methods of forming same | Kai-Chih Liang, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin | 2016-11-22 |
| 9487391 | Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate | Chun-Wen Cheng | 2016-11-08 |
| 9488615 | Biosensor with a sensing surface on an interlayer dielectric | Chun-Wen Cheng, Fei-Lung Lai, Yi-Hsien Chang, Hsin-Chieh Huang | 2016-11-08 |
| 9469527 | MEMS pressure sensor and microphone devices having through-vias and methods of forming same | Chun-Wen Cheng | 2016-10-18 |
| 9466532 | Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same | Kuei-Sung Chang, Te-Hao Lee | 2016-10-11 |
| 9459234 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chun-Ren Cheng, Chun-Wen Cheng | 2016-10-04 |
| 9462402 | Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone | Chin-Yi Cho, Chun-Wen Cheng, Jung-Huei Peng, Yao-Te Huang | 2016-10-04 |
| 9459224 | Gas sensor, integrated circuit device using the same, and manufacturing method thereof | Chun-Wen Cheng, Fei-Lung Lai, Shiang-Chi Lin | 2016-10-04 |
| 9452924 | MEMS devices and fabrication methods thereof | Chun-Wen Cheng, Te-Hao Lee, Chung-Hsien Lin | 2016-09-27 |
| 9450109 | MEMS devices and fabrication methods thereof | Chun-Wen Cheng, Te-Hao Lee, Chung-Hsien Lin | 2016-09-20 |
| 9403673 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Yu-Chia Liu, Kuei-Sung Chang, Chun-Wen Cheng | 2016-08-02 |
| 9394161 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Jung-Huei Peng | 2016-07-19 |
| 9388040 | Stacked semiconductor device and method of forming the same related cases | Chun-Wen Cheng | 2016-07-12 |
| 9386380 | Method for the integration of a microelectromechanical systems (MEMS) microphone device with a complementary metal-oxide-semiconductor (CMOS) device | Chun-Wen Cheng | 2016-07-05 |
| 9337182 | Method to integrate different function devices fabricated by different process technologies | Kuei-Sung Chang, Chun-Wen Cheng, Alex Kalnitsky | 2016-05-10 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2016-05-10 |
| 9309109 | MEMS-CMOS integrated devices, and methods of integration at wafer level | Chun-Wen Cheng | 2016-04-12 |
| 9293431 | Integrated semiconductor device and wafer level method of fabricating the same | Kuei-Sung Chang, Chun-Wen Cheng, Alexander Kalnitsky | 2016-03-22 |
| 9290376 | MEMS packaging techniques | Chun-Wen Cheng, Chien-Hsuan Tai | 2016-03-22 |
| 9260295 | MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same | Chun-Wen Cheng | 2016-02-16 |
| 9264833 | Structure and method for integrated microphone | Jung-Huei Peng, Yao-Te Huang, Chin-Yi Cho, Li-Min Hung, Chun-Wen Cheng | 2016-02-16 |
| 9260296 | MEMS integrated pressure sensor devices and methods of forming same | Chun-Wen Cheng | 2016-02-16 |