Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2016-10-18 |
| 9462402 | Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone | Chin-Yi Cho, Chia-Hua Chu, Chun-Wen Cheng, Yao-Te Huang | 2016-10-04 |
| 9394161 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Chia-Hua Chu | 2016-07-19 |
| 9352315 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung | 2016-05-31 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2016-05-31 |
| 9355896 | Package systems | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai | 2016-05-31 |
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Li-Chen CHU, Hung-Hua Lin, H. T. Huang, Yuan-Chih Hsieh +3 more | 2016-03-22 |
| 9269679 | Wafer level packaging techniques | Yi-Chuan Teng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Chin-Yi Cho | 2016-02-23 |
| 9264833 | Structure and method for integrated microphone | Chia-Hua Chu, Yao-Te Huang, Chin-Yi Cho, Li-Min Hung, Chun-Wen Cheng | 2016-02-16 |
| 9238581 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee | 2016-01-19 |
| 9233839 | MEMS device and method of forming the same | Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng | 2016-01-12 |