Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2016-10-18 |
| 9352315 | Method to produce chemical pattern in micro-fluidic structure | Li-Min Hung, Jung-Huei Peng | 2016-05-31 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2016-05-31 |
| 9355896 | Package systems | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Jung-Huei Peng | 2016-05-31 |
| 9269679 | Wafer level packaging techniques | Yi-Chuan Teng, Jung-Huei Peng, Li-Min Hung, Yao-Te Huang, Chin-Yi Cho | 2016-02-23 |
| 9246401 | Energy-harvesting device and method of forming the same | Tien-Kan Chung, Wen-Chuan Tai, Yao-Te Huang, Hsin-Ting Huang, Chang-Yi Yang +1 more | 2016-01-26 |
| 9238581 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2016-01-19 |