Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2016-10-18 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2016-05-31 |
| 9269679 | Wafer level packaging techniques | Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Chin-Yi Cho | 2016-02-23 |
| 9238578 | Semiconductor arrangement with stress release and thermal insulation | Chun-Wen Cheng, Chia-Hua Chu | 2016-01-19 |