Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2016-10-18 |
| 9422153 | Support structure for TSV in MEMS structure | Yi Heng Tsai, Kuei-Sung Chang | 2016-08-23 |
| 9403674 | Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs) | Chun-Wen Cheng | 2016-08-02 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2016-05-31 |
| 9315378 | Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding | Chun-Wen Cheng | 2016-04-19 |