Issued Patents 2016
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9522822 | Sensor integration with an outgassing barrier and a stable electrical signal path | Chia-Hua Chu | 2016-12-20 |
| 9523642 | Integrated electro-microfluidic probe card, system and method for using the same | Yi-Shao Liu, Fei-Lung Lai, Chun-Ren Cheng | 2016-12-20 |
| 9511997 | MEMS device with a capping substrate | Chia-Hua Chu | 2016-12-06 |
| 9505605 | Methods and apparatus for MEMS devices with increased sensitivity | Chia-Hua Chu | 2016-11-29 |
| 9493346 | Capacitor with planarized bonding for CMOS-MEMS integration | Wei-Cheng Shen, Yi-Hsien Chang, Yi Heng Tsai, Tzu-Heng Wu, Chun-Ren Cheng | 2016-11-15 |
| 9487391 | Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate | Chia-Hua Chu | 2016-11-08 |
| 9488615 | Biosensor with a sensing surface on an interlayer dielectric | Fei-Lung Lai, Chia-Hua Chu, Yi-Hsien Chang, Hsin-Chieh Huang | 2016-11-08 |
| 9469527 | MEMS pressure sensor and microphone devices having through-vias and methods of forming same | Chia-Hua Chu | 2016-10-18 |
| 9469524 | Semiconductor device with through molding vias and method of making the same | Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2016-10-18 |
| 9459224 | Gas sensor, integrated circuit device using the same, and manufacturing method thereof | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2016-10-04 |
| 9462402 | Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone | Chin-Yi Cho, Chia-Hua Chu, Jung-Huei Peng, Yao-Te Huang | 2016-10-04 |
| 9459234 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng | 2016-10-04 |
| 9452924 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2016-09-27 |
| 9449867 | VHF etch barrier for semiconductor integrated microsystem | Tzu-Heng Wu, Yi-Hsien Chang, Kai-Chih Liang, Yi Heng Tsai, Wei-Cheng Shen +2 more | 2016-09-20 |
| 9450109 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2016-09-20 |
| 9446945 | Isolation structure for MEMS 3D IC integration | Yi Heng Tsai, Yi-Hsien Chang, Chun-Ren Cheng, Tzu-Heng Wu, Wei-Cheng Shen | 2016-09-20 |
| 9403674 | Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs) | Hung-Chia Tsai | 2016-08-02 |
| 9403673 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang | 2016-08-02 |
| 9395326 | FET sensing cell and method of improving sensitivity of the same | Tung-Tsun Chen, Jui-Cheng Huang, Chin-Hua Wen, Yi-Shao Liu | 2016-07-19 |
| 9394161 | MEMS and CMOS integration with low-temperature bonding | Chia-Hua Chu, Jung-Huei Peng | 2016-07-19 |
| 9388040 | Stacked semiconductor device and method of forming the same related cases | Chia-Hua Chu | 2016-07-12 |
| 9389199 | Backside sensing bioFET with enhanced performance | Yi-Shao Liu, Fei-Lung Lai, Wei-Cheng Lin, Ta-Chuan Liao, Chien-Kuo Yang | 2016-07-12 |
| 9386380 | Method for the integration of a microelectromechanical systems (MEMS) microphone device with a complementary metal-oxide-semiconductor (CMOS) device | Chia-Hua Chu | 2016-07-05 |
| 9359194 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof | Kai-Chih Liang | 2016-06-07 |
| 9355896 | Package systems | Chia-Pao Shu, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng | 2016-05-31 |