Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9493346 | Capacitor with planarized bonding for CMOS-MEMS integration | Wei-Cheng Shen, Yi-Hsien Chang, Yi Heng Tsai, Chun-Ren Cheng, Chun-Wen Cheng | 2016-11-15 |
| 9446945 | Isolation structure for MEMS 3D IC integration | Yi Heng Tsai, Yi-Hsien Chang, Chun-Ren Cheng, Chun-Wen Cheng, Wei-Cheng Shen | 2016-09-20 |
| 9449867 | VHF etch barrier for semiconductor integrated microsystem | Yi-Hsien Chang, Kai-Chih Liang, Yi Heng Tsai, Wei-Cheng Shen, Chun-Ren Cheng +2 more | 2016-09-20 |