Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502370 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Ting-Hau Wu | 2016-11-22 |
| 9493346 | Capacitor with planarized bonding for CMOS-MEMS integration | Wei-Cheng Shen, Yi-Hsien Chang, Tzu-Heng Wu, Chun-Ren Cheng, Chun-Wen Cheng | 2016-11-15 |
| 9446945 | Isolation structure for MEMS 3D IC integration | Yi-Hsien Chang, Chun-Ren Cheng, Chun-Wen Cheng, Tzu-Heng Wu, Wei-Cheng Shen | 2016-09-20 |
| 9449867 | VHF etch barrier for semiconductor integrated microsystem | Tzu-Heng Wu, Yi-Hsien Chang, Kai-Chih Liang, Wei-Cheng Shen, Chun-Ren Cheng +2 more | 2016-09-20 |
| 9422153 | Support structure for TSV in MEMS structure | Kuei-Sung Chang, Hung-Chia Tsai | 2016-08-23 |
| 9418849 | Cavity structure using patterned sacrificial layer | Kuei-Sung Chang | 2016-08-16 |
| 9281287 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Ting-Hau Wu | 2016-03-08 |
| 9266724 | Method for handling a thin substrate and for substrate capping | Kuei-Sung Chang | 2016-02-23 |