Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502370 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Yi Heng Tsai | 2016-11-22 |
| 9394164 | MEMS method and structure | Kuei-Sung Chang | 2016-07-19 |
| 9321632 | Socket type MEMS bonding | — | 2016-04-26 |
| 9281287 | Semiconductor bonding structure and process | Kuei-Sung Chang, Nien-Tsung Tsai, Yi Heng Tsai | 2016-03-08 |
| 9238581 | Triple-axis MEMS accelerometer | Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee, Jung-Huei Peng | 2016-01-19 |