Issued Patents 2016
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502370 | Semiconductor bonding structure and process | Nien-Tsung Tsai, Ting-Hau Wu, Yi Heng Tsai | 2016-11-22 |
| 9481564 | Method of sealing and shielding for dual pressure MEMs devices | — | 2016-11-01 |
| 9466532 | Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same | Chia-Hua Chu, Te-Hao Lee | 2016-10-11 |
| 9422153 | Support structure for TSV in MEMS structure | Yi Heng Tsai, Hung-Chia Tsai | 2016-08-23 |
| 9418849 | Cavity structure using patterned sacrificial layer | Yi Heng Tsai | 2016-08-16 |
| 9403673 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng | 2016-08-02 |
| 9394164 | MEMS method and structure | Ting-Hau Wu | 2016-07-19 |
| 9355896 | Package systems | Chia-Pao Shu, Chun-Wen Cheng, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng | 2016-05-31 |
| 9337182 | Method to integrate different function devices fabricated by different process technologies | Chun-Wen Cheng, Alex Kalnitsky, Chia-Hua Chu | 2016-05-10 |
| 9316704 | Magnetic sensor and forming method | Chun-Wen Cheng | 2016-04-19 |
| 9293431 | Integrated semiconductor device and wafer level method of fabricating the same | Chun-Wen Cheng, Alexander Kalnitsky, Chia-Hua Chu | 2016-03-22 |
| 9281287 | Semiconductor bonding structure and process | Nien-Tsung Tsai, Ting-Hau Wu, Yi Heng Tsai | 2016-03-08 |
| 9266724 | Method for handling a thin substrate and for substrate capping | Yi Heng Tsai | 2016-02-23 |
| 9233839 | MEMS device and method of forming the same | Yu-Chia Liu, Chia-Hua Chu, Jung-Huei Peng, Chun-Wen Cheng | 2016-01-12 |