Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9499396 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee | 2016-11-22 |
| 9452924 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Te-Hao Lee | 2016-09-27 |
| 9450109 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Te-Hao Lee | 2016-09-20 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2016-05-10 |