| 9527188 |
Grinding wheel for wafer edge trimming |
Xin-Hua Huang, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai |
2016-12-27 |
| 9472504 |
Semiconductor having a high aspect ratio via |
Li-Cheng Chu, Ming-Tung Wu, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai |
2016-10-18 |
| 9446467 |
Integrate rinse module in hybrid bonding platform |
Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Lan-Lin Chao +2 more |
2016-09-20 |
| 9434076 |
Robot blade design |
Lee-Chuan Tseng, Chih-Jen Chan, Shih-Wei Lin, Che-Ming Chang, Chung-Yen Chou |
2016-09-06 |
| 9377401 |
Biological sensing structures |
Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai |
2016-06-28 |
| 9355882 |
Transfer module for bowed wafers |
Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai |
2016-05-31 |
| 9337168 |
Hermetic wafer level packaging |
Richard Chu, Martin Liu, Chia-Hua Chu, Chung-Hsien Lin, Lan-Lin Chao +2 more |
2016-05-10 |
| 9293445 |
Wafer level packaging bond |
Ping-Yin Liu, Li-Chen CHU, Hung-Hua Lin, H. T. Huang, Jung-Huei Peng +3 more |
2016-03-22 |
| 9242853 |
Method of improving getter efficiency by increasing superficial area |
Li-Cheng Chu, Hung-Hua Lin, Chih-Jen Chan, Lan-Lin Chao |
2016-01-26 |
