Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Hung-Hua Lin, H. T. Huang, Jung-Huei Peng, Yuan-Chih Hsieh +3 more | 2016-03-22 |
LC
Li-Chen CHU
Overall (2016): #316,177 of 481,213Top 70%
1
Patents 2016