Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508586 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-11-29 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Xin-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2016-09-20 |
| 9377401 | Biological sensing structures | Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-06-28 |
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Li-Chen CHU, H. T. Huang, Jung-Huei Peng, Yuan-Chih Hsieh +3 more | 2016-03-22 |
| 9242853 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Li-Cheng Chu, Chih-Jen Chan, Lan-Lin Chao | 2016-01-26 |