Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337168 | Hermetic wafer level packaging | Richard Chu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2016-05-10 |
ML
Martin Liu
Overall (2016): #303,881 of 481,213Top 65%
1
Patents 2016