Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490158 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2016-11-08 |
| 9437572 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2016-09-06 |
| 9349769 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Shyh-Fann Ting, Ching-Chun Wang | 2016-05-24 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2016-02-09 |