Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9525003 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2016-12-20 |
| 9455288 | Image sensor structure to reduce cross-talk and improve quantum efficiency | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Wen-De Wang | 2016-09-27 |
| 9455158 | 3DIC interconnect devices and methods of forming same | Shu-Ting Tsai, Szu-Ying Chen, Tzu-Hsuan Hsu, Feng-Chi Hung, Dun-Nian Yaung | 2016-09-27 |
| 9449914 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2016-09-20 |
| 9437578 | Stacked IC control through the use of homogenous region | Wen-I Hsu, Cheng-Ying Ho, Feng-Chi Hung, Dun-Nian Yaung | 2016-09-06 |
| 9391114 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Min-Feng Kao, Chun-Ming Su +1 more | 2016-07-12 |
| 9391101 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Yan-Chih Lu | 2016-07-12 |
| 9362329 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2016-06-07 |
| 9318526 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2016-04-19 |
| 9287312 | Imaging sensor structure and method | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2016-03-15 |
| 9245912 | Method and apparatus for low resistance image sensor contact | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chun-Chieh Chuang +1 more | 2016-01-26 |