Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466486 | Method for integrated circuit patterning | Ming-Feng Shieh, Ru-Gun Liu, Tien-I Bao, Chung-Ju Lee, Shau-Lin Shue | 2016-10-11 |
| 9443768 | Method of making a FinFET device | Ming-Feng Shieh, Han-Wei Wu | 2016-09-13 |
| 9437497 | Method of making a FinFET device | Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin | 2016-09-06 |
| 9372406 | Film portion at wafer edge | Chun-Wei Chang, Wang-Pen Mo | 2016-06-21 |
| 9360755 | Thickening phase for spin coating process | Chun-Wei Chang, Chia-Chieh Lin, Chih-Chien Wang, Wang-Pen Mo | 2016-06-07 |
| 9349662 | Test structure placement on a semiconductor wafer | Chuan-Ling Wu, Cheng-Hsien Chuang, Chun-Chang Chen, Wang-Pen Mo | 2016-05-24 |
| 9304403 | System and method for lithography alignment | Yu-Hsien Lin, Feng-Jia Shiu, Chun-Yi Lee | 2016-04-05 |
| 9285677 | Lithography process on high topology features | Chun-Wei Chang, Hong-Da Lin, Chih-Chien Wang, Chun-Chang Chen, Wang-Pen Mo | 2016-03-15 |
| 9280041 | Cross quadrupole double lithography method using two complementary apertures | Hsien-Cheng Wang, Shih-Che Wang, Ping-Chieh Wu, Wen-Chun Huang, Ming-Chang Wen | 2016-03-08 |