Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9425150 | Multi-via interconnect structure and method of manufacture | Yu-Fei Huang, Ming Li, Edward Wan, Dun-Nian Yaung, Cheng-Eng D. Chen | 2016-08-23 | $2,056,000 |