Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524942 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, An-Jhih Su, Chi-Hsi Wu | 2016-12-20 |
| 9281254 | Methods of forming integrated circuit package | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Hsiang-Fan Lee, Tang-Jung Chiu | 2016-03-08 |