Issued Patents 2016
Showing 1–25 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530757 | Single mask package apparatus | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo | 2016-12-27 |
| 9520385 | Package structure and method for forming same | Kuo-Chuan Liu | 2016-12-13 |
| 9515036 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chien-Hsiun Lee, Chung-Shi Liu | 2016-12-06 |
| 9508696 | Laser marking in packages | — | 2016-11-29 |
| 9502343 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2016-11-22 |
| 9502364 | Semiconductor package and method of forming the same | An-Jhih Su | 2016-11-22 |
| 9502270 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2016-11-22 |
| 9502272 | Devices and methods of packaging semiconductor devices | Jie Chen | 2016-11-22 |
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-11-08 |
| 9490192 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen | 2016-11-08 |
| 9484227 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2016-11-01 |
| 9478511 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Kai-Chiang Wu, Hung-Jui Kuo | 2016-10-25 |
| 9478521 | Package-on-package Structure | An-Jhih Su, Ying-Ju Chen | 2016-10-25 |
| 9478443 | Semiconductor package and method of forming the same | An-Jhih Su | 2016-10-25 |
| 9478505 | Guard ring design structure for semiconductor devices | Chung-Ying Yang | 2016-10-25 |
| 9472522 | Packaging devices and methods of manufacture thereof | Jie Chen | 2016-10-18 |
| 9471111 | Hinge mechanism and portable electronic device | Yi-Ta Huang, Wen-Chieh Tai, Cheng-Nan Ling, Chun-I Chen | 2016-10-18 |
| 9461025 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2016-10-04 |
| 9461020 | Semiconductor package including an embedded surface mount device and method of forming the same | Der-Chyang Yeh, Ming-Yen Chiu, Ying-Ju Chen | 2016-10-04 |
| 9449947 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2016-09-20 |
| 9449927 | Seal ring structure with metal-insulator-metal capacitor | Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai, Hao-Yi Tsai, Tsung-Yuan Yu | 2016-09-20 |
| 9443812 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Tsung-Yuan Yu, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-09-13 |
| 9443780 | Semiconductor device having recessed edges and method of manufacture | — | 2016-09-13 |
| 9437739 | Finfet seal ring | Tsung-Yuan Yu | 2016-09-06 |
| 9437567 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Ying-Ju Chen, Shih-Wei Liang | 2016-09-06 |