Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515036 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chung-Shi Liu, Hsien-Wei Chen | 2016-12-06 |
| 9449941 | Connecting function chips to a package to form package-on-package | Pei-Chun Tsai, Sheng-Yu Wu, Ching-Wen Hsiao, Tin-Hao Kuo, Chen-Shien Chen +2 more | 2016-09-20 |
| 9240387 | Wafer-level chip scale package with re-workable underfill | Hsien-Wei Chen, Tsung-Ding Wang, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-01-19 |