Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508674 | Warpage control of semiconductor die package | Kuo Lung Pan, Chen-Shien Chen | 2016-11-29 |
| 9449941 | Connecting function chips to a package to form package-on-package | Pei-Chun Tsai, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen, Chung-Shi Liu +2 more | 2016-09-20 |
| 9418969 | Packaged semiconductor devices and packaging methods | Yen-Chang Hu, Chen-Shien Chen | 2016-08-16 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2016-06-14 |
| 9355933 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen | 2016-05-31 |
| 9349699 | Front side copper post joint structure for temporary bond in TSV application | Hon-Lin Huang, Kuo-Ching Hsu, Chen-Shien Chen | 2016-05-24 |
| 9330947 | Methods for forming package-on-package structures having buffer dams | Shou-Cheng Hu, Chen-Shien Chen | 2016-05-03 |
| 9324910 | Light emitting diode | Hsin-Hsien Wu, Chyi Shyuan Chern, Chun-Lin Chang, Kuang-Huan Hsu | 2016-04-26 |
| 9293449 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Shou-Cheng Hu, Chen-Shien Chen, Tin-Hao Kuo, Chih-Hua Chen | 2016-03-22 |
| 9257332 | Through-assembly via modules and methods for forming the same | Chih-Hua Chen, Chen-Shien Chen | 2016-02-09 |
| 9258922 | PoP structures including through-assembly via modules | Chih-Hua Chen, Chen-Shien Chen | 2016-02-09 |