Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9330947 | Methods for forming package-on-package structures having buffer dams | Ching-Wen Hsiao, Chen-Shien Chen | 2016-05-03 |
| 9293449 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Chen-Shien Chen, Tin-Hao Kuo, Chih-Hua Chen, Ching-Wen Hsiao | 2016-03-22 |