Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490167 | Pop structures and methods of forming the same | Hsu-Hsien Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2016-11-08 |
| 9478474 | Methods and apparatus for forming package-on-packages | Hsu-Hsien Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2016-10-25 |
| 9343442 | Passive devices in package-on-package structures and methods for forming the same | Chen-Shien Chen | 2016-05-17 |
| 9312230 | Conductive pillar structure for semiconductor substrate and method of manufacture | Chen-Shien Chen, Chen-Cheng Kuo | 2016-04-12 |
| 9293449 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Shou-Cheng Hu, Chen-Shien Chen, Tin-Hao Kuo, Ching-Wen Hsiao | 2016-03-22 |
| 9257332 | Through-assembly via modules and methods for forming the same | Chen-Shien Chen, Ching-Wen Hsiao | 2016-02-09 |
| 9258922 | PoP structures including through-assembly via modules | Chen-Shien Chen, Ching-Wen Hsiao | 2016-02-09 |