Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472521 | Scheme for connector site spacing and resulting structures | Yao-Chun Chuang, Chita Chuang, Hao-Juin Liu, Chen-Shien Chen | 2016-10-18 |
| 9397059 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2016-07-19 |
| 9373598 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2016-06-21 |
| 9312230 | Conductive pillar structure for semiconductor substrate and method of manufacture | Chih-Hua Chen, Chen-Shien Chen | 2016-04-12 |
| 9287191 | Semiconductor device package and method | Hao-Juin Liu, Chita Chuang, Chen-Shien Chen | 2016-03-15 |
| 9257412 | Stress reduction apparatus | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chita Chuang, Chen-Shien Chen | 2016-02-09 |