Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406629 | Semiconductor package structure and manufacturing method thereof | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen +1 more | 2016-08-02 |
| 9373598 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2016-06-21 |
| 9355933 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Chen-Shien Chen | 2016-05-31 |