Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355933 | Cooling channels in 3DIC stacks | Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen | 2016-05-31 |
| 9236359 | System and method for 3D integrated circuit stacking | — | 2016-01-12 |